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TANAKA develops low-temperature Sintering Technology using Silver Nano Ink

TANAKA develops low-temperature Sintering Technology using Silver Nano Ink
PR-Inside.com: 2018-09-12 16:19:29
TANAKA Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Akira Tanae) announced today that TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Representative Director and CEO: Akira Tanae), which operates TANAKA Precious Metals manufacturing business, has developed a wire forming technology (low-temperature sintered silver nanometal printing technique) capable of sintering at low temperatures of 70°C using the Company's low-temperature sintered silver nano ink, and a full-surface silver metal film forming technology (a full-surface silver metal film forming technique) using existing etching[1] processes.


This technology will contribute to thinner devices, increased flexibility, and higher image quality of smartphone touch panels, organic electroluminescence displays, andother applications.


Low-temperature sintered silver nanometal printing technique: Features


- Previous silver nano ink sintering was only possible at high temperatures of 130-140°C, which made it difficult to print on organic materials such as the comparatively heat-sensitive PET film and other engineering plastic[2] films. However, the newly developed low-temperature sintered silver nanometal printing technique achieves a resistance of 50 micro-ohm centimeters or less, which is equivalent to sintering at high temperatures, even at the low sintering temperature of 70°C. This has dramatically improved the freedom to choose organic materials on which to print.


- Sintering silver nano wire circuitry at the low temperature of 70°C does not damage materials such as organic luminescence elements[3] and contributes to enhanced image quality.


- Patterns formed by low-temperature sintering can consist of several layers to several dozen layers of silver nanoparticles to create multilayer sintered thin film structures, which is expected to provide improved bending strength (flexibility) compared to previous products.


The combination of low-temperature sintered silver nano ink with TANAKA Kikinzoku Kogyo's SuPR-NaP[4] technique-based metal mesh wiring technology[5] enables fine wires of 4 micrometers or less to be formed on the film.


A full-surface silver metal film forming technology: Features


- By sintering low-temperature sintered silver nano ink at 140°C, it is possible to form full-surface silver metal films capable of etching and with an equivalent or better level of electrical resistance to that achieved by indium tin oxide (ITO), which is commonly used in current touch panels and other devices.


- Capital investment and other costs can be reduced because existing etching processes can be used.


- Silver metal mesh substrates formed with this technology have an equivalent or better level of electrical resistance to that achieved by transparent electrodes[6] made from indium tin oxide (ITO) etched into a glass substrate. With improved bending strength (flexibility) and improved transparency as well, they are expected to enable enhanced image quality.


As a result of the advantages offered by these products, application in high-end smartphone touch panels, which are expected to shift to bendable displays, and uses and applications in the flexible electronic device market, which is projected to grow, and the organic electroluminescence display market, which is looking for thinner products and enhanced image quality, are expected.


Press release in PDF: www.acnnewswire.com/clientreports/598/180912_EN.pdf

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