2009-02-26 14:07:01 -

Research and Markets (www.researchandmarkets.com/research/401f06/advanced_electroni) has announced the addition of the "Advanced Electronic Packaging - Global Strategic Business Report" report to their offering.


This report analyzes the worldwide markets for Advanced Electronic Packaging in Millions of US$. The specific product segments analyzed are Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual forecasts are provided for each region for the period of 2000 through 2015. The report profiles 77 companies including many key and niche players worldwide such as Advanced Semiconductor Engineering Group, ASAT Holdings Limited, STATS ChipPAC Ltd., Amkor Technology Inc., ASM International NV, ASM Pacific Technology Ltd., CARSEM,

Chipbond Technology Corp, ChipMos Technologies, FlipChip International, Fujitsu Ltd, NEC Electronics Corporation, Orient Semiconductor Electronics, Sliconware Precision Industries Co., Ltd., STATS ChipPAC Ltd., Tessera, Inc., Toshiba America Electronic Components Inc., and Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.


Key Topics Covered:


I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS


II. EXECUTIVE SUMMARY


- Current and Future Analysis
- Industry Overview
- Issues and Trends
- Growth Drivers
- Product Overview
- Product Introductions/Innovations
- Recent Industry Activity
- Focus on Select Players
- Global Market Perspective
III. MARKET


- The United States
- Canada
- Japan
- Europe
- Asia-Pacific
- Rest of World
IV. COMPETITIVE LANDSCAPE


For more information visit www.researchandmarkets.com/research/401f06/advanced_electroni








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