2008 IET & GSA International Semiconductor Forum Exhibitor Profiles
2008-05-12 10:02:05 -
www.businesswire.com - 2008 IET & GSA International Semiconductor Forum takes place May 14 - 15, 2008 in London. Listed below are the 2008 IET & GSA International Semiconductor Forum exhibitor profiles.
For in-depth information about 2008 IET & GSA International Semiconductor Forum, visit ietgsasemiconductorforum.com/.
Business Wire is the official news wire for 2008 IET & GSA International Semiconductor Forum. Breaking news releases and photos are available at www.tradeshownews.com, Business Wire's trade show, conference, and event news resource. -0- Company: Analog Bits Inc. Stand: 105 Media Contact: Mahesh Tirupattur Phone: 650 314 0200 E-mail: mahesh@analogbits.com Web: www.analogbits.com Analog Bits, Inc. specializes in designing transistor level IP components fully customized for easy and reliable integration into modern CMOS digital chips. Products include precision clocking macros such as PLLs, DLLs, programmable interconnect solutions such as multi-protocol SERDES/PMA, programmable I/Os and specialized memories such as high-speed SRAMs, T-CAMs. With billions of IP fabricated in customer silicon from 0.35-um to 45-nm processes, Analog Bits is the premier IP supplier with an outstanding heritage of "first time working silicon" at merchant foundries and IDMs. Company: ARM Stand: 206 Ticker Symbol & Exchange: ARMH Media Contact: Erik Ploof Phone: 1.425.880.6033 E-mail: erik.ploof@arm.com Web: www.arm.com ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM's comprehensive product offering includes 32-bit RISC microprocessors, graphics processors, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the company's broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. More information on ARM is available at www.arm.com." Company: DELTA Microelectronics Stand: 208 Phone: 45 7219 4000 E-mail: asic@delta.dk Web: www.delta.dk/asic DELTA offers complete Application Specific Integrated Circuit (ASIC) development and production services including design, test development, failure analysis, wafer procurement, production testing, packaging, logistics and supply chain management. These services are available with flexible business models and different solutions to satisfy our customer requirements. DELTA's development capabilities cover digital, mixed signal, system-on-chip (SoC) and including deep submicron technologies. Company: e-Shuttle, Inc. Stand: 215 Media Contact: Hiroyuki Asahide Phone: 81-3-5322-3328 E-mail: asahide@jp.fujitsu.com Web: www.eshuttle.co.jp Headquartered in Japan, e-Shuttle, Inc. was established by Fujitsu Microelectronics Limited and Advantest Corporation to develop Electron Bean Direct Write (EBDW) technologies for 90-, 65- and 45- nanometer process technologies, and to establish and offer semiconductor prototyping services, SiExpress(TM). The application of 300mm EBDW with associated process technologies at critical interconnect layers can reduce mask costs for logic devices at the 90nm/65nm process nodes. e-Shuttle has started to use EBDW for via layers of 90nm/65nm technologies. It also plans to introduce EBDW for 45nm and beyond technologies with Advantest's EBDW equipment the F3000. Company: MIPS Technologies, Inc. Stand: 211 Ticker Symbol & Exchange: NasdaqGS: MIPS Media Contact: Jen Bernier Phone: 650-567-5178 E-mail: jenb@mips.com Web: www.mips.com MIPS Technologies, the world's second largest semiconductor design IP company and number one analog IP company worldwide, is a Platinum Plus Sponsor of the 2008 IET & GSA International Semiconductor Forum. MIPS is also sponsoring this year's VIP Dinner, hosted by MIPS' President and CEO, John Bourgoin. On Wednesday, Carlos Leme, CTO and VP of Wireless Solutions for MIPS' Analog Business Group, will join a panel discussion, "Process Choices for Analogue and RF Circuits in Mixed Signal Systems." During Thursday's Town Hall Session, Dr. Joao Vital, VP of Data Conversion Solutions for the Analog Business Group, will discuss "Leveraging Talent and Opportunities through Diverse Design Centers." Company: Quik-Pak and OptoCap Stand: 104 Media Contact: Steve Swendrowski Phone: 858-521-3601 E-mail: steves@icproto.com Web: www.icproto.com Quik-Pak, a division of Delphon Industries, will partner with UK based Optocap limited to provide European customers with a full turnkey solution for their IC packaging and prototyping needs. The two companies will co-exhibit at the upcoming IET & GSA International Semiconductor Forum in London, England May 14-15. Quik-Pak provides IC packages, wafer preparation, assembly and prototyping services, specializing in open cavity plastic packages and assembly in 24 hours or less. Optocap's service focuses on the full product development cycle including assembly, qualification and failure analysis. The combination of the Quik-Pak open cavity packages and Optocap's local assembly capabilities will enable European customers to obtain "true" local quick-turn prototyping services. Company: Virage Logic Stand: 212 Ticker Symbol & Exchange: VIRL Nasdaq Media Contact: Sabina Burns Phone: 650-743-8115 E-mail: sabina.burns@viragelogic.com Web: www.viragelogic.com As the semiconductor industry's trusted IP partner, Virage Logic provides a broad portfolio of silicon proven IP targeted at the world's leading foundry processes from 250- to 40-nanometer (nm).Virage Logic's Silicon Aware IP(TM) (embedded memories, logic libraries, I/Os) includes silicon behavior knowledge for increased predictability and manufacturability. The company also offers high performance and high efficiency DDR memory controller interface solutions. Virage Logic's highly differentiated product portfolio provides higher performance, lower power, higher density and optimal yield to foundries, IDMs and fabless customers developing products for consumer, communications and networking, hand-held and portable, computer and graphics, automotive, and defense markets.
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