2008-07-23 03:34:06 -

www.nexxsystems.com - NEXX Systems today announced that it has shipped a Stratus S300 (300 mm) electrodeposition system to Singapore, representing the second Stratus 300 mm tool to be installed at this company for high-volume production. With the inherent simplicity of the Stratus, NEXX anticipates production start-up in August.

"This shipment," stated Richard Post, CEO of

NEXX Systems, "represents an important milestone in the market acceptance of the Stratus platform. We now have multiple customers who are purchasing follow-on Stratus tools to handle their high-volume production requirements in both 200 and 300 mm packaging applications."

The Stratus provides industry-leading yield at the lowest cost of ownership for pattern plating and TSV applications. Innovative ShearPlate(TM) technology eliminates the complex process tuning and process drift adjustment required by competing multi-zone anode fountain tools. The Stratus is the technology leader for TSV, solder bumping, copper pillar, UBM, and other advanced packaging applications.

About NEXX Systems: NEXX Systems brings exceptional technical expertise to flip chip and advanced packaging. Our product lines provide the most efficient, yet affordable, systems of their kind: Apollo for multi-layer sputter deposition of metals, and Stratus for high throughput electrodeposition of metals. Additional information can be found at: www.nexxsystems.com.

"Safe Harbor" statement: This release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 regarding future events or the future performance of NEXX Systems. These statements are only predictions. Actual events or results may differ materially from those in other forward-looking statements set forth herein. Among the important factors that could cause actual events to differ materially from those in other forward-looking statements are potential fluctuations in quarterly results, dependence on new product development, rapid technological and market change, acquisition strategy, manufacturing and sourcing risks, volatility of stock price, international operations, financial risk management, and future growth subject to risks. NEXX Systems is under no obligation to, and expressly disclaims any obligation to, update or alter its forward-looking statements, whether as a result of new information, future events or otherwise.

NEXX Systems
Richard S. Post, 978-932-2030
Chief Executive Officer